Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development

被引：38

作者：

Lee, Jung-Sub ^{[1
]}

Chu, Kun-Mo ^{[1
]}

Patzelt, Rainer ^{[2
]}

Manessis, Dionysios ^{[2
]}

Ostmann, Andreas ^{[2
]}

Jeon, Duk Young ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea

[2] Fraunhofer IZM, Dept Chip Interconnect Technol & Adv Packages, D-13355 Berlin, Germany

来源：

MICROELECTRONIC ENGINEERING | 2008年 / 85卷 / 07期

基金：

欧洲研究理事会;

关键词：

Sn-3.5Ag; Co addition; composite solder;

D O I：

10.1016/j.mee.2008.03.002

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, the approach of composite solder using eutectic Sn-3.5Ag solder and Co was tried. Co particles and Sn-3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn-3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn-3.5Ag solder bumps. As a result, Co addition up to 2 wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn-3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (CU,Co)(3)Sn-2 intermetallic compounds. (C) 2008 Elsevier B.V. All rights reserved.

引用

页码：1577 / 1583

页数：7

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