Co-simulation of On-Chip and On-Board AC Power Noise of CMOS Digital Circuits

被引:3
|
作者
Yoshikawa, Kumpei [1 ]
Sasaki, Yuta [1 ]
Ichikawa, Kouji [2 ]
Saito, Yoshiyuki [3 ]
Nagata, Makoto [1 ]
机构
[1] Kobe Univ, Grad Sch Syst Informat, Kobe, Hyogo 6578501, Japan
[2] DENSO Corp, Kariya, Aichi 4488661, Japan
[3] Panasonic Corp, Kadoma, Osaka 5718501, Japan
关键词
LSI chip-package-board co-design; electromagnetic compatibility; power supply noise; power delivery network;
D O I
10.1587/transfun.E95.A.2284
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Capacitor charging modeling efficiently and accurately represents power consumption current of CMOS digital circuits and actualizes co-simulation of AC power noise including the interaction with on-chip and on-board integrated power delivery network (PDN). It is clearly demonstrated that the AC power noise is dominantly characterized by the frequency-dependent impedance of PDN and also by the operating frequency of circuits as well. A 65 nm CMOS chip exhibits the AC power noise components in substantial relation with the parallel resonance of the PDN seen from on-chip digital circuits. An on-chip noise monitor measures in-circuit power supply voltage, while a near-field magnetic probing derives on-board power supply current. The proposed co-simulation well matches the power noise measurements. The proposed AC noise co-simulation will be essentially applicable in the design of PDNs toward on-chip power supply integrity (PSI) and off-chip electromagnetic compatibility (EMC).
引用
收藏
页码:2284 / 2291
页数:8
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