Structural health monitoring of solder joints in QFN package

被引：15

作者：

Gershman, I. ^{[1
]}

Bernstein, J. B. ^{[1
]}

机构：

[1] Bar Ilan Univ, Sch Engn, IL-52900 Ramat Gan, Israel

来源：

MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 12期

关键词：

PROGNOSTICS;

D O I：

10.1016/j.microrel.2012.07.001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

QFN is very attractive package especially when it is used for power components. Its electrical and thermal performance turned this package to a very desirable for high speed and high power components. However the drawback of QFN package is its low reliability in applications that experience thermal cycles such as automotive and aerospace. A novel technique presented in this paper suggests a quantitative measurement tool for crack propagation in QFN solder-joints that could predict end-of-life of monitored joints. The technique that has been developed is based on serial ohmic resistance changes in solder joints as a function of crack propagation. A combination of mathematical model and measured data of solder-joints' ohmic resistance provides a structural health monitoring tool of QFN solder-joints. This could be used as a prognostic tool to remaining useful life of QFN package. (C) 2012 Elsevier Ltd. All rights reserved.

引用

页码：3011 / 3016

页数：6

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