Grain-boundary diffusion of germanium in copper and Cu-Ge and Cu-Fe alloys

被引：1

作者：

Terent'ev, Yu A. ^{[1
]}

Bokstein, B. S. ^{[1
]}

Pomadchik, A. L. ^{[1
]}

Popova, D. E. ^{[1
]}

Rodin, A. O. ^{[1
]}

机构：

[1] Natl Univ Sci & Technol MISiS, Moscow 119049, Russia

来源：

RUSSIAN JOURNAL OF NON-FERROUS METALS | 2012年 / 53卷 / 05期

关键词：

Grain-boundary diffusion; grain boundaries; copper; germanium; iron; electron-probe microanalysis (EPMA); concentration dependence; ATOMIC COMPLEXES; SEGREGATION;

D O I：

10.3103/S1067821212050124

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The grain-boundary diffusion (GBD) of germanium in copper and its alloys Cu-2% Ge and Cu-0.5% Fe is investigated in the temperature range of 500-590A degrees C by means of electron-probe microanalysis. The GBD parameters (triple product P = s delta D (GB) and effective activation energy E) are found. The temperature dependence of the triple product for germanium GBD in pure copper can be described by equation P = 3 x 10(15)exp[-80 kJ mol(-1)/(RT)] m(3) s(-1). It is shown that the addition of Ge has almost no effect on the GBD parameters in copper, while doping with iron leads to a considerable reduction in the triple product.

引用

页码：380 / 385

页数：6

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