Study on Two kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film

被引：3

作者：

Jin, Z. J. ^{[1
]}

Yuan, Z. W. ^{[1
]}

Kang, R. K. ^{[1
]}

Dong, B. X. ^{[1
]}

机构：

[1] Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China

来源：

ADVANCES IN ABRASIVE TECHNOLOGY XI | 2009年 / 389-390卷

关键词：

CVD diamond; Dynamic Friction Polishing; Grinding wheel;

D O I：

10.4028/www.scientific.net/KEM.389-390.217

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This paper investigates two kinds of grinding wheels prepared by the combination of mechanical alloy and hot-press sintering (MA-HPS). Scanning electro microscopy, Optical microscope, Talysurf surface profiler, X-Ray diffraction and Raman spectroscopy were used to characterize two kinds of grinding wheels and identify the removal mechanism. It was found that FeNiCr matrix-TiC (FMT) grinding wheel yielded higher removal rate than TiAl abrasiveless carbophile (TAC) grinding wheel, which conversely owned good polishing quality; diamond was removed by transformation diamond to non-diamond carbons and then removed by mechanically or diffusion to grinding wheel during polishing process with FMT grinding wheel. While TAC grinding wheel polishing CVD diamond film mainly depended on the reaction between diamond carbon and titanium.

引用

页码：217 / 222

页数：6

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