Enhanced thermal stability of nanograined metals below a critical grain size

被引:362
作者
Zhou, X. [1 ,2 ]
Li, X. Y. [1 ]
Lu, K. [1 ]
机构
[1] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China
[2] Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Anhui, Peoples R China
基金
美国国家科学基金会;
关键词
HIGH-PRESSURE TORSION; HIGH-PURITY COPPER; PURE COPPER; NANOCRYSTALLINE MATERIALS; BOUNDARY DISSOCIATION; SOLUTE SEGREGATION; TEMPERATURE; EMISSION; DEFORMATION; EXTRUSION;
D O I
10.1126/science.aar6941
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
The limitation of nanograined materials is their strong tendency to coarsen at elevated temperatures. As grain size decreases into the nanoscale, grain coarsening occurs at much lower temperatures, as low as ambient temperatures for some metals. We discovered that nanometer-sized grains in pure copper and nickel produced from plastic deformation at low temperatures exhibit notable thermal stability below a critical grain size. The instability temperature rises substantially at smaller grain sizes, and the nanograins remain stable even above the recrystallization temperatures of coarse grains. The inherent thermal stability of nanograins originates from an autonomous grain boundary evolution to low-energy states due to activation of partial dislocations in plastic deformation.
引用
收藏
页码:526 / 529
页数:4
相关论文
共 33 条
[1]   Emergence of stable interfaces under extreme plastic deformation [J].
Beyerlein, Irene J. ;
Mayeur, Jason R. ;
Zheng, Shijian ;
Mara, Nathan A. ;
Wang, Jian ;
Misra, Amit .
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 2014, 111 (12) :4386-4390
[2]   AN INSITU TEM STUDY OF THE THERMAL-STABILITY OF NANOCRYSTALLINE NI-P [J].
BOYLAN, K ;
OSTRANDER, D ;
ERB, U ;
PALUMBO, G ;
AUST, KT .
SCRIPTA METALLURGICA ET MATERIALIA, 1991, 25 (12) :2711-2716
[3]   Observation of atomic diffusion at twin-modified grain boundaries in copper [J].
Chen, Kuan-Chia ;
Wu, Wen-Wei ;
Liao, Chien-Neng ;
Chen, Lih-Juann ;
Tu, K. N. .
SCIENCE, 2008, 321 (5892) :1066-1069
[4]   Design of Stable Nanocrystalline Alloys [J].
Chookajorn, Tongjai ;
Murdoch, Heather A. ;
Schuh, Christopher A. .
SCIENCE, 2012, 337 (6097) :951-954
[5]   Atomistic simulation of dislocation emission in nanosized grain boundaries [J].
Derlet, PM ;
Van Swygenhoven, H ;
Hasnaoui, A .
PHILOSOPHICAL MAGAZINE, 2003, 83 (31-34) :3569-3575
[6]   Effect of pinning by an orientation gradient on the thermal stability of ultrafine grained Ni produced by equal channel angular pressing [J].
Divinski, Sergiy V. ;
Reglitz, Gerrit ;
Wegner, Matthias ;
Peterlechner, Martin ;
Wilde, Gerhard .
JOURNAL OF APPLIED PHYSICS, 2014, 115 (11)
[7]   Thermal stability of ultrafine-grained copper during high speed micro-extrusion [J].
Gu, C. F. ;
Davies, C. H. J. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (7-8) :1791-1799
[8]   Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion [J].
Higuera-Cobos, O. F. ;
Cabrera, J. M. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 571 :103-114
[9]   Emission of dislocations from grain boundaries by grain boundary dissociation [J].
Hoagland, Richard G. ;
Valone, Steven M. .
PHILOSOPHICAL MAGAZINE, 2015, 95 (02) :112-131
[10]   The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion [J].
Huang, Yi ;
Sabbaghianrad, Shima ;
Almazrouee, Abdulla I. ;
Al-Fadhalah, Khaled J. ;
Alhajeri, Saleh N. ;
Langdon, Terence G. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 656 :55-66