Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication Applications

被引：0

作者：

Ho, Cheng-Yu ^{[1
]}

Jhong, Ming-Fong ^{[1
]}

Pan, Po-Chih ^{[1
]}

Huang, Chih-Yi ^{[1
]}

Wang, Chen-Chao ^{[1
]}

Ting, Chun-Yen ^{[1
]}

机构：

[1] Adv Semicond Engn ASE Inc, Corp Design Div, Elect Lab, Corp Res & Dev, 26 Chin 3rd Rd Nantze Export Proc, Kaohsiung 811, Taiwan

来源：

2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) | 2017年

关键词：

TECHNOLOGY;

D O I：

10.1109/ECTC.2017.202

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This work proposes a Yagi-Uda array with fan-like driver for millimeter-wave application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip ball grid array (FCBGA) package. The package size is 16 x 8 x 0.44 mm(3). The proposed four-element antenna array results in a peak gain of 12 - 14.5 dBi at operating frequency band. The proposed antenna achieves both broadband and high gain characteristics for millimeter-wave application. The proposed antenna array is also used to develop a low-cost 60-GHz switched-beam antenna array with butler matrix network. This work provides a cost-effective approach to implement a switched-beam antenna array for fifth-generation mobile communications (5G), IEEE 802.11ad, such as smart phone, laptops, and wireless router.

引用

页码：242 / 247

页数：6

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