A new structure design of a silicon-on-insulator MOSFET reducing the self-heating effect

被引:9
作者
Awadallah, R [1 ]
Yuan, JS [1 ]
机构
[1] Univ Cent Florida, Dept Elect & Comp Engn, Orlando, FL 32816 USA
关键词
D O I
10.1080/002072199133166
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new silicon-on-insulator (SOI) device structure is proposed. The new design provides a heat conducting path between the channel and substrate. The device has been verified in two-dimensional device simulation. This new structure reduces device self-heating and increases the drain of the SOI MOSFET.
引用
收藏
页码:707 / 712
页数:6
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