The Numerical Simulation Analysis of Tuyere's Temperature Field and Stress Field

被引：7

作者：

Guo, Xi-Ping ^{[1
]}

Han, Wen-Yue ^{[1
]}

机构：

[1] Inner Mongolia Univ Sci & Technol, Inst Mech Engn, Baotou 014010, Inner Mongolia, Peoples R China

来源：

MECHATRONICS AND INTELLIGENT MATERIALS III, PTS 1-3 | 2013年 / 706-708卷

关键词：

numerical modeling; temperature field; stress field; structure;

D O I：

10.4028/www.scientific.net/AMR.706-708.1701

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Research on the temperature field and stress field of tuyere by numerical modeling and analyse the influence of structure on tuyere's property.

引用

页码：1701 / +

页数：2

共 4 条

[1]

[Anonymous], 2004, COMPUTATIONAL FLUID

Chen, CW .

Gu, Mingyan ;

Chen, Guang ;

Zhang, Mingchuan ;

Huang, D. ;

Chaubal, Pinakin ;

Zhou, Chenn Q. .

Nogami, H ;

Chu, MS ;

Yagi, J .