Study on the properties of Sn-9Zn-xCr lead-free solder

被引：87

作者：

Chen, Xi ^{[1
]}

Hu, Anmin ^{[1
]}

Li, Ming ^{[1
]}

Mao, Dali ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Key Lab High Temp Mat & Tests, Minist Educ, Sch Mat Sci & Engn, Shanghai 200030, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2008年 / 460卷 / 1-2期

关键词：

oxidation; microstructure; mechanical properties;

D O I：

10.1016/j.jallcom.2007.05.087

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The influences of different Cr content to lead (Sn)-Zn solder were investigated. Sn-9Zn-xCr shows finer and more uniform microstructure than Sn-9Zn. Thermal gravimetric analysis (TGA) and Auger electron spectroscopy (AES) results show that adding Cr significantly improves the oxidation resistance of Sn-9Zn solder, and reduces the thickness of oxidation film of Sn-9Zn-xCr solder. When Cr content is 0.1%, the Sn-9Zn-0.1Cr solder have the best oxidation resistance. In addition, the effect of Cr addition on the wettability, melting point and mechanical properties of Sn-9Zn solder was discussed. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：478 / 484

页数：7

共 29 条

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