Application of Aerosol Jet 3-D Printing With Conductive and Nonconductive Inks for Manufacturing mm-Wave Circuits

被引:19
作者
Piekarz, Ilona [1 ]
Sorocki, Jakub [1 ]
Craton, Michael Thomas [2 ]
Wincza, Krzysztof [1 ]
Gruszczynski, Slawomir [1 ]
Papapolymerou, John [2 ]
机构
[1] AGH Univ Sci & Technol, PL-30059 Krakow, Poland
[2] Michigan State Univ, E Lansing, MI 48824 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2019年 / 9卷 / 03期
关键词
3-D printing; additive manufacturing; aerosol jet printing (AJP); circuit fabrication; millimeter (mm)-wave circuits; RF;
D O I
10.1109/TCPMT.2018.2889698
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, an application of aerosol jet 3-D printing with conductive and nonconductive inks for the realization of millimeter (mm)-wave circuits well above 30 GHz is presented and investigated. The Optomec 5X aerosol jet 3-D printing system is used together with polyimide (PI) and silver inks to fully-additive manufacture various microstrip circuits. A section of microstrip transmission line with a transition to a via-less conductor-backed coplanar waveguide was designed together with a T-junction and a branch-line coupler. These circuits were designed to operate within the Ka and V frequency bands. The measured thickness of the PI dielectric substrate is 20.7 +/- 1.35 mu m, while the silver traces are 2.6 +/- 1.35 mu m. A section of the transmission line with the developed transitions was measured up to the W-band, exhibiting a total loss of 0.65 dB/mm at 100 GHz. The T-junction power divider yielded a total loss at its center frequency of 34 GHz of 0.55 dB. The 3-dB branch-line coupler yielded a loss at its center frequency at 42 GHz of 1.1 dB. The experimental results demonstrate the application of this approach for fast and high-resolution mm-wave circuit fabrication.
引用
收藏
页码:586 / 595
页数:10
相关论文
共 30 条
[1]   Noninvasive Material Thickness Detection by Aerosol Jet Printed Sensors Enhanced Through Metallic Carbon Nanotube Ink [J].
Andrews, Joseph B. ;
Cao, Changyong ;
Brooke, Martin A. ;
Franklin, Aaron D. .
IEEE SENSORS JOURNAL, 2017, 17 (14) :4612-4618
[2]  
[Anonymous], 2012, P 2012 FUT INSTR INT, DOI DOI 10.1145/3313831.3376543
[3]  
[Anonymous], 2016, DUP KAPT HN POL FILM
[4]   Exploring 3-D Printing for New Applications [J].
Bahr, Ryan ;
Tehrani, Bijan ;
Tentzeris, Manos M. .
IEEE MICROWAVE MAGAZINE, 2018, 19 (01) :57-66
[5]   Design of 3-D monolithic MMW antennas using ceramic stereolithography [J].
Brakora, Karl F. ;
Halloran, John ;
Sarabandi, Kamal .
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2007, 55 (03) :790-797
[6]   Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization [J].
Byford, Jennifer A. ;
Ghazali, Mohd Ifwat Mohd ;
Karuppuswami, Saranraj ;
Wright, Brian L. ;
Chahal, Premjeet .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 7 (03) :463-471
[7]  
Cai F., 2014, 2014 IEEE MTT-S International Microwave Symposium (IMS2014): IEEE), P1
[8]   Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies [J].
Cai, Fan ;
Chang, Yung-Hang ;
Wang, Kan ;
Zhang, Chuck ;
Wang, Ben ;
Papapolymerou, John .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2016, 64 (10) :3208-3216
[9]  
Cai F, 2014, EUR MICROW CONF, P512, DOI 10.1109/EuMC.2014.6986483
[10]   Development of a Ku-Band Corrugated Conical Horn Using 3-D Print Technology [J].
Chieh, Jia-Chi Samuel ;
Dick, Brian ;
Loui, Stuart ;
Rockway, John D. .
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2014, 13 :201-204