Role of metal-oxide interfaces in the multiple resistance switching regimes of Pt/HfO2/TiN devices

被引:79
作者
Brivio, S. [1 ]
Frascaroli, J. [1 ]
Spiga, S. [1 ]
机构
[1] CNR, IMM, Lab MDM, I-20864 Agrate Brianza, Italy
关键词
HFO2; RRAM; TIN; MEMORIES; OXIDATION; BEHAVIOR;
D O I
10.1063/1.4926340
中图分类号
O59 [应用物理学];
学科分类号
摘要
The multiple resistive switching of Pt/HfO2/TiN devices is demonstrated as a result of a competition between the switching at opposite metal/oxide interfaces. Three switching operation modes are demonstrated: clockwise (CW) switching (set for negative voltage and reset for positive voltage at Pt electrode), as already reported in literature for similar material stacks; counterclockwise (CCW) switching and complementary switching (CS) that consist in a set and a reset for increasing voltage of the same polarity. The multiple switching operation modes are enabled by a deep-reset operation that brings the cell resistance close to the initial one. As a consequence, the set transition after a deep-reset occurs at the same voltage and currents as those of the forming and leads to a low resistance state whose resistance can be further decreased in a CCW switching or increased back with a CW switching. With a suitable choice of the stop voltage, a CS in obtained, as well. The coexistence of all three CW, CCW, and CS operations demonstrates that both metal-oxide interfaces are active in the formation and the dissolution of conductive filaments responsible for the switching. All these observations are discussed in terms of a competition between ion migration processes occurring at the opposite metal-oxide interfaces. (C) 2015 AIP Publishing LLC.
引用
收藏
页数:5
相关论文
共 48 条
[41]  
Traoré B, 2013, PROC EUR S-STATE DEV, P170, DOI 10.1109/ESSDERC.2013.6818846
[42]   Highly Uniform, Self-Compliance, and Forming-Free ALD HfO2-Based RRAM With Ge Doping [J].
Wang, Zhongrui ;
Zhu, W. G. ;
Du, A. Y. ;
Wu, L. ;
Fang, Z. ;
Tran, X. A. ;
Liu, W. J. ;
Zhang, K. L. ;
Yu, H. -Y. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 59 (04) :1203-1208
[43]   The role of the HfO2-TiN interface in capacitance-voltage nonlinearity of Metal-Insulator-Metal capacitors [J].
Wenger, Ch. ;
Lukosius, M. ;
Weidner, G. ;
Muessig, H. -J. ;
Pasko, S. ;
Lohe, Ch. .
THIN SOLID FILMS, 2009, 517 (23) :6334-6336
[44]   Effect of low constant current stress treatment on the performance of the Cu/ZrO2/Pt resistive switching device [J].
Xie, Hongwei ;
Liu, Qi ;
Li, Yingtao ;
Lv, Hangbing ;
Wang, Ming ;
Zhang, Kangwei ;
Long, Shibing ;
Liu, Su ;
Liu, Ming .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2012, 27 (10)
[45]   Memristive Devices in Computing System: Promises and Challenges [J].
Yang, J. Joshua ;
Williams, R. Stanley .
ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, 2013, 9 (02)
[46]   Impedance spectroscopic analysis on effects of partial oxidation of TiN bottom electrode and microstructure of amorphous and crystalline HfO2 thin films on their bipolar resistive switching [J].
Yoon, Ji-Wook ;
Yoon, Jung Ho ;
Lee, Jong-Heun ;
Hwang, Cheol Seong .
NANOSCALE, 2014, 6 (12) :6668-6678
[47]   Conduction mechanism of TiN/HfOx/Pt resistive switching memory: A trap-assisted-tunneling model [J].
Yu, Shimeng ;
Guan, Ximeng ;
Wong, H. -S. Philip .
APPLIED PHYSICS LETTERS, 2011, 99 (06)
[48]   Role of interfacial layer on complementary resistive switching in the TiN/HfOx/TiN resistive memory device [J].
Zhang, H. Z. ;
Ang, D. S. ;
Gu, C. J. ;
Yew, K. S. ;
Wang, X. P. ;
Lo, G. Q. .
APPLIED PHYSICS LETTERS, 2014, 105 (22)