Enhancement of Dimensional Stability and Optical Transparency of Colorless Organo-Soluble Polyimide by Incorporation of Silica and Cosolvent

被引:21
作者
Tsai, Mei-Hui [1 ]
Tseng, I-Hsiang [1 ,2 ]
Huang, Shih-Liang [1 ]
Hsieh, Ching-Wen [1 ]
机构
[1] Natl Chin Yi Univ Technol, Dept Chem & Mat Engn, Taichung, Taiwan
[2] Feng Chia Univ, Dept Chem Engn, Taichung 40724, Taiwan
关键词
Coefficient of thermal expansion; colorless; CTE; polyimide; silica; transparent; LOW-DIELECTRIC-CONSTANT; ONE-STEP; MECHANICAL-PROPERTIES; NANOCOMPOSITE FILMS; HIGHLY TRANSPARENT; THERMAL-STABILITY; HIGH SOLUBILITY; TRIFLUOROMETHYL; DIANHYDRIDE; MORPHOLOGY;
D O I
10.1080/00914037.2013.769247
中图分类号
TB3 [工程材料学]; R318.08 [生物材料学];
学科分类号
0805 ; 080501 ; 080502 ;
摘要
One facile approach to synthesize colorless polyimide (PI) film with enhanced dimensional stability and optical transparency is presented. With the optimum weight ratio of cosolvent GBL/DMAc, the PI film demonstrates the highest thermal stability and optical transparency. A further improvement in dimensional stability and optical transparency is achieved by blending silica sol and coupling agent in PI solution. The PI-50wt%SiO2 film exhibits a low coefficient of thermal expansion of 26ppm/degrees C, high optical transmittance at 550nm of 90.1%, and an ultra-low yellow index less than 1.4, indicating its potential application as substrate material in advanced microelectronic applications. [Supplementary materials are available for this article. Go to the publisher's online edition of International Journal of Polymeric Materials and Polymeric Biomaterials for the SI Figures.]
引用
收藏
页码:48 / 56
页数:9
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