3D Printed Interconnects on Bendable Substrates for 3D Circuits

被引：0

作者：

Nassar, Habib ^{[1
]}

Pullanchiyodan, Abhilash ^{[1
]}

Bhattacharjee, Mitradip ^{[1
]}

Dahiya, Ravinder ^{[1
]}

机构：

[1] Univ Glasgow, Bendable Elect & Sensing Technol Best, Glasgow G12 8QQ, Lanark, Scotland

来源：

PROCEEDINGS OF THE 2019 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (IEEE FLEPS 2019) | 2019年

基金：

欧盟地平线“2020”; 英国工程与自然科学研究理事会;

关键词：

COMPONENTS;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页数：3

共 20 条

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