Analysis and Optimization of Transformer-Based Power Combining for Back-Off Efficiency Enhancement

被引：17

作者：

Kaymaksut, Ercan ^{[1
]}

Francois, Brecht ^{[1
]}

Reynaert, Patrick ^{[1
]}

机构：

[1] Katholieke Univ Leuven, Dept Elect Engn ESAT, Microelect & Sensors Div MICAS, B-3001 Louvain, Belgium

来源：

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS | 2013年 / 60卷 / 04期

关键词：

Back-off efficiency; CMOS technology; Doherty power amplifier; series combining transformer; DISTRIBUTED ACTIVE-TRANSFORMER; AMPLIFIER; CMOS;

D O I：

10.1109/TCSI.2012.2221223

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper analyzes the back-off efficiency enhancement characteristics of transformer combined power amplifiers taking into account the amplifier and transformer parasitics. The dynamic power combining properties of different transformer architectures are investigated. The co-optimization of the transformer and the amplifiers is presented for the transformer-based Doherty power amplifier which is a linear class of operation with back-off efficiency enhancement. Then this analysis is extended for the uneven Doherty power amplifier which employs asymmetrical transformers. The proposed design methodology is used to design a 2.4 GHz uneven Doherty power amplifier in standard 90 nm CMOS technology. The fabricated two stage Doherty amplifier achieves 26.2 dBm peak output power at 2 V supply. The measured peak drain efficiency of the PA is 37% while the efficiency at 6 dB back-off is still as high as 30.1%.

引用

页码：825 / 835

页数：11

共 13 条

[11]

Wei Tai, 2011, 37th European Solid State Circuits Conference (ESSCIRC 2011), P131, DOI 10.1109/ESSCIRC.2011.6044882

[12] A+31.5 dBm CMOS RF Doherty power amplifier for wireless communications [J].

Wongkomet, Naratip ;

Tee, Luns ;

Gray, Paul R. .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2006, 41 (12) :2852-2859

[13] A 2.4 GHz fully integrated cascode-cascade CMOS doherty power amplifier [J].

Yang, Li-Yuan ;

Chen, Hsin-Shu ;

Chen, Yi-Jan Emery .

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2008, 18 (03) :197-199

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