High-Q MEMS for wireless integrated circuits

While integration technology has steadily improved size and performance for wireless baseband circuitry, quality factor and frequency limitations still limit RF front-end circuitry to many large discrete components. Integration solutions for two such RF components are described here. Silicon MEMS techniques are used to create self-assembled inductors with reduced losses and improved high frequency characteristics compared to conventional integrated inductors. The same technology is used to demonstrate variable inductors. Filter technology based on micromachined acoustic wave resonators is also presented, offering reduced size over conventional resonators as well as an integration path.