High-Q MEMS for wireless integrated circuits

被引：0
|
作者：
Lubecke, VM [1 ]
Barber, BP [1 ]
Fetter, LA [1 ]
机构：
[1] Bell Labs, Lucent Technol, Murray Hill, NJ 07974 USA
来源：
TELSIKS 2001, VOL 1 & 2, PROCEEDINGS | 2001年
关键词：
MEMS; RFIC; BAW; micromechanical; acoustic; resonator; inductor;
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
While integration technology has steadily improved size and performance for wireless baseband circuitry, quality factor and frequency limitations still limit RF front-end circuitry to many large discrete components. Integration solutions for two such RF components are described here. Silicon MEMS techniques are used to create self-assembled inductors with reduced losses and improved high frequency characteristics compared to conventional integrated inductors. The same technology is used to demonstrate variable inductors. Filter technology based on micromachined acoustic wave resonators is also presented, offering reduced size over conventional resonators as well as an integration path.
引用
收藏
页码：203 / 209
页数：7
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