Microscale Fracture Behavior of Single Crystal Silicon Beams at Elevated Temperatures

被引:56
作者
Jaya, Balila Nagamani [1 ]
Wheeler, Jeffrey M. [2 ]
Wehrs, Juri [3 ]
Best, James P. [3 ]
Soler, Rafael [1 ]
Michler, Johann
Kirchlechner, Christoph [1 ,3 ,4 ]
Dehm, Gerhard [1 ]
机构
[1] Max Planck Inst Eisenforsch GmbH, Struct & NanoMicromech Mat, Max Planck Str 1, D-40237 Dusseldorf, Germany
[2] Swiss Fed Inst Technol, Lab Nanomet, Dept Mat, Vladimir Prelog Weg 5, CH-8093 Zurich, Switzerland
[3] Empa, Swiss Fed Labs Mat Sci & Technol, Lab Mech Mat & Nanostruct, Feuerwerkerstr 39, CH-3602 Thun, Switzerland
[4] Univ Leoben, Dept Mat Phys, A-8700 Leoben, Austria
基金
瑞士国家科学基金会;
关键词
Microscale fracture; brittle-to-ductile transition; fracture toughness; single crystal silicon; BRITTLE-DUCTILE TRANSITION; MECHANICAL-BEHAVIOR;
D O I
10.1021/acs.nanolett.6b03461
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The micromechanical fracture behavior of Si [100] was investigated as a function of temperature in the scanning electron microscope with a nanoindenter. A gradual increase in K-C was observed with temperature, in contrast to sharp transitions reported earlier for macro Si. A transition in cracking mechanism via crack branching occurs at similar to 300 degrees C accompanied by multiple load drops. This reveals that onset of small-scale plasticity plays an important role in the brittle-to-ductile transition of miniaturized Si.
引用
收藏
页码:7597 / 7603
页数:7
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