共 50 条
[31]
Transient Analysis Of Crosstalk Coupling Between High-Speed Carbon Nanotube Interconnects
[J].
2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3,
2008,
:81-86
[32]
Analysis of the Electrical Performance of Multi-Coupled High-Speed Interconnects for SoP
[J].
2009 52ND IEEE INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1 AND 2,
2009,
:1030-+
[33]
High-speed Probe Card Design to Reduce the Crosstalk Noise for Wafer-level Test
[J].
2014 IEEE 23RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS,
2014,
:117-120
[34]
BGA Routing Impact on High-Speed Signals
[J].
IEEE 30TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2021),
2021,
[35]
Layout parasitic limitations in high-speed circuits
[J].
2006 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2,
2007,
:375-+
[36]
Characterization of 2D high-speed photodetector array device for SDM fiber communication applications
[J].
2019 24TH OPTOELECTRONICS AND COMMUNICATIONS CONFERENCE (OECC) AND 2019 INTERNATIONAL CONFERENCE ON PHOTONICS IN SWITCHING AND COMPUTING (PSC),
2019,
[37]
Channel Analysis of High Speed Digital Module and Correlation between Simulations and Measurements
[J].
2013 17TH IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI),
2013,
[39]
Modeling and Analysis of Signal Integrity of High-Speed Interconnected Channel With Degraded Contact Surface
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,
2019, 9 (11)
:2227-2236
[40]
Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2001, 24 (03)
:260-267