Crack-free high-aspect-ratio drilling of glasses by 1 μm yttrium aluminum garnet laser and translucent adhesive tape

被引：5

作者：

Baasandash, C

Yabe, T

Maehara, J

Yamaguchi, M

Wakatsuki, H

机构：

[1] Tokyo Inst Technol, Dept Engn Sci & Mech, Meguro Ku, Tokyo 1528552, Japan

[2] Asahi Glass Co Ltd, Res Ctr, Yokohama, Kanagawa 2218577, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS | 2004年 / 43卷 / 2A期

关键词：

nanosecond laser; laser processing; glass; CIP method;

D O I：

10.1143/JJAP.43.L133

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We have succeeded in drilling a crack-free high-aspect-ratio hole through glass using a YAG laser of 1 mum wavelength, 5 ns pulse width and 30-630 mJ/pulse. The hole is 25.5 mm long with 500 mum radius and no crack is observed even under atmospheric conditions. This success is due to the use of a translucent adhesive tape pasted on the glass surface in which the temperature is controlled and thermal stress is reduced. Computer simulation revealed the mechanism of the phenomena.

引用

页码：L133 / L135

页数：3

共 6 条

[1]

BAUEGLE D, 1996, LASER PROCESSING CHE

[2] Laser micromachining of silicate glasses containing silver ions using a pulsed laser [J].