Microstructure and fracture properties of reaction-assisted diffusion bonding of TiAl intermetallic with Al/Ni multilayer foils

被引:60
作者
Cao, J. [1 ]
Feng, J. C. [1 ]
Li, Z. R. [1 ]
机构
[1] Harbin Inst Technol, State Key Lab Adv Welding Prod Technol, Harbin 150001, Peoples R China
基金
中国国家自然科学基金;
关键词
Intermetallics; Thin films; Microstructure; Scanning electron microscopy;
D O I
10.1016/j.jallcom.2007.11.033
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Reaction-assisted diffusion bonding of TiAl intermetallic was performed using Al/Ni multilayer foils as interlayers. The typical microstructure and the joining mechanism were investigated. The Ni-3(AlTi), Ni2AlTi, NiAl2Ti and (Ni,Al,Ti) reaction phases were observed at the interface between the Al/Ni multilayer foils and the TiAl substrate. The reaction products in the multilayer foils were mostly composed of AlNi3. The joining between the multilayer and the substrate relied on the formation of Ti-Al-Ni compounds. The joining temperature played a strong influence on the microstructure of the joint. The fracture mainly took place between the NiAl2Ti layer and the substrate and the fracture presented a typical brittle characteristic. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:363 / 367
页数:5
相关论文
共 16 条
[1]   THE PROPAGATION OF A SOLID-STATE COMBUSTION WAVE IN NI-AL FOILS [J].
ANSELMITAMBURINI, U ;
MUNIR, ZA .
JOURNAL OF APPLIED PHYSICS, 1989, 66 (10) :5039-5045
[2]   Al/Ni formation reactions:: characterization of the metastable Al9Ni2 phase and analysis of its formation [J].
Blobaum, KJ ;
Van Heerden, D ;
Gavens, AJ ;
Weihs, TP .
ACTA MATERIALIA, 2003, 51 (13) :3871-3884
[3]  
Cam G, 1999, INTERMETALLICS, V7, P1025
[4]   Electron beam welding of a Ti-45Al-2Nb-2Mn+0.8 vol% TiB2 XD alloy [J].
Chaturvedi, MC ;
Richards, NL ;
Xu, Q .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1997, 240 :605-612
[5]   Solid-state diffusion bonding of gamma-TiAl alloys using Ti/Al thin films as interlayers [J].
Duarte, L. I. ;
Ramos, A. S. ;
Vieira, M. F. ;
Viana, F. ;
Vieira, M. T. ;
Kocak, M. .
INTERMETALLICS, 2006, 14 (10-11) :1151-1156
[6]   Reactive nanostructured foil used as a heat source for joining titanium [J].
Duckham, A ;
Spey, SJ ;
Wang, J ;
Reiss, ME ;
Weihs, TP ;
Besnoin, E ;
Knio, OM .
JOURNAL OF APPLIED PHYSICS, 2004, 96 (04) :2336-2342
[7]   Microstructure evolution and reaction mechanism during reactive joining of TiAl intermetallic to TiC cermet using Ti-Al-C-Ni interlayer [J].
Feng, J. C. ;
Cao, J. ;
Li, Z. R. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 436 (1-2) :298-302
[8]   On the mechanism of heterogeneous reaction and phase formation in Ti/Al multilayer nanofilms [J].
Gachon, JC ;
Rogachev, AS ;
Grigoryan, HE ;
Illarionova, EV ;
Kuntz, JJ ;
Kovalev, DY ;
Nosyrev, AN ;
Sachkova, NV ;
Tsygankov, PA .
ACTA MATERIALIA, 2005, 53 (04) :1225-1231
[9]   Calorimetric determination of NiAl3-growth kinetics in sputter-deposited Ni/Al diffusion couples [J].
Michaelsen, C ;
Barmak, K .
JOURNAL OF ALLOYS AND COMPOUNDS, 1997, 257 (1-2) :211-214
[10]   Joining of nickel monoaluminide to a superalloy substrate by high pressure self-propagating high-temperature synthesis [J].
Pascal, C ;
Marin-Ayral, RM ;
Tédenac, JC .
JOURNAL OF ALLOYS AND COMPOUNDS, 2002, 337 :221-225