Structural properties of N-rich a-Si-N:H films with a low electron-trapping rate

被引:37
作者
Dupont, G [1 ]
Caquineau, H [1 ]
Despax, B [1 ]
Berjoan, R [1 ]
Dollet, A [1 ]
机构
[1] INST SCI & GENIE MAT & PROCEDES,F-66125 FONT ROMEU,FRANCE
关键词
D O I
10.1088/0022-3727/30/7/002
中图分类号
O59 [应用物理学];
学科分类号
摘要
Hydrogenated amorphous silicon nitride (a-SiNx:H) films with a high nitrogen content were prepared by RF plasma-enhanced chemical vapour deposition from a mixture of SiH4 and NH3 at 300 degrees C. The influence of the main operating variables on the quality of the material was examined. Characteristics and properties of the films were investigated using optical absorption, infrared spectroscopy, x-ray photo-electron spectroscopy and capacitance-voltage measurements. From infrared transmission and reflection measurements, it was found most of the IR peaks obtained by direct transmission in the range 850-1040 cm(-1), which have often been mentioned in the literature, are caused not by absorption but rather by a strong reflection due to the Reststrahlen effect. IR studies carried out with polarized light revealed an anisotropic beam-sample interaction probably due to short-range phonon vibration modes: a parallel 'LO mode' (1040-1070 cm(-1)), a parallel and perpendicular 'TO mode' (840 cm(-1)). For sufficiently high values of the N/Si ratio, a decreasing percentage of SiH4 or an increasing RF power leads to a decrease in the trapped charge density which should be related simultaneously to an increase in the N/Si ratio and a decrease in the Si-H bond density in the deposited films. It is suggested that, under our experimental conditions, the charged particle bombardment due to the RF discharge does not play an important role in the charge trapping and that the trapping rate seems to be controlled only by the nature of the traps.
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页码:1064 / 1076
页数:13
相关论文
共 48 条
  • [11] ANALYSIS AND NUMERICAL MODELING OF SILICON-NITRIDE DEPOSITION IN A PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION REACTOR .1. BIDIMENSIONAL MODELING
    DOLLET, A
    COUDERC, JP
    DESPAX, B
    [J]. PLASMA SOURCES SCIENCE & TECHNOLOGY, 1995, 4 (01) : 94 - 106
  • [12] DUNNETT B, 1986, PHILOS MAG B, V57, P159
  • [13] DANGLING BONDS IN MEMORY-QUALITY SILICON-NITRIDE FILMS
    FUJITA, S
    SASAKI, A
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (02) : 398 - 402
  • [14] GALEENER FL, 1976, PHYS REV LETT, V37, P1414
  • [15] ANALYSIS OF THE OXYGEN CONTAMINATION PRESENT IN SINX FILMS DEPOSITED BY ELECTRON-CYCLOTRON-RESONANCE
    GARCIA, S
    MARTIN, JM
    FERNANDEZ, M
    MARTIL, I
    GONZALEZDIAZ, G
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1995, 13 (03): : 826 - 830
  • [16] GROWTH AND CHARACTERIZATION OF SILICON-NITRIDE FILMS BY PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION
    HAN, IK
    LEE, YJ
    JO, JW
    LEE, JI
    KANG, KN
    [J]. APPLIED SURFACE SCIENCE, 1991, 48-9 : 104 - 110
  • [17] Harrick N.J., 1979, INTERNAL REFLECTION
  • [18] AMORPHOUS SIN-H DIELECTRICS WITH LOW-DENSITY OF DEFECTS
    HASEGAWA, S
    MATUURA, M
    KURATA, Y
    [J]. APPLIED PHYSICS LETTERS, 1986, 49 (19) : 1272 - 1274
  • [19] HOWLING AA, 1991, P 20 INT C PHEN ION, V5
  • [20] ELECTRONIC-STRUCTURE OF SILICON-NITRIDE AND AMORPHOUS-SILICON SILICON-NITRIDE BAND OFFSETS BY ELECTRON-SPECTROSCOPY
    IQBAL, A
    JACKSON, WB
    TSAI, CC
    ALLEN, JW
    BATES, CW
    [J]. JOURNAL OF APPLIED PHYSICS, 1987, 61 (08) : 2947 - 2954