Micromachining of Invar with 784 Beams Using 1.3 ps Laser Source at 515 nm

被引:17
作者
Hauschwitz, Petr [1 ,2 ]
Stoklasa, Bohumil [3 ]
Kucharik, Jiri [3 ]
Turcicova, Hana [1 ]
Pisarik, Michael [1 ]
Brajer, Jan [1 ]
Rostohar, Danijela [1 ]
Mocek, Tomas [1 ]
Duda, Martin [1 ,2 ]
Lucianetti, Antonio [1 ]
机构
[1] Czech Acad Sci, Inst Phys, HiLASE Ctr, Za Radnici 828, Dolni Brezany 25241, Czech Republic
[2] Czech Tech Univ, Fac Nucl Sci & Phys Engn, Brehova 7, Prague 11519, Czech Republic
[3] Meopta Opt Sro, Kabelikova 1, Prerov 75002, Czech Republic
基金
欧盟地平线“2020”;
关键词
multi-beam micromachining; beam splitting; invar; shadow masks; OLED; ABLATION;
D O I
10.3390/ma13132962
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
To fulfil the requirements for high-resolution organic light-emitting diode (OLED) displays, precise and high-quality micrometer-scale patterns have to be fabricated inside metal shadow masks. Invar has been selected for this application due to its unique properties, especially a low coefficient of thermal expansion. In this study, a novel cost-efficient method of multi-beam micromachining of invar will be introduced. The combination of a Meopta beam splitting, focusing and monitoring module with a galvanometer scanner and HiLASE high-energy pulse laser system emitting ultrashort pulses at 515 nm allows drilling and cutting of invar foil with 784 beams at once with high precision and almost no thermal effects and heat-affected zone, thus significantly improving the throughput and efficiency.
引用
收藏
页码:1 / 9
页数:9
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