The effect of twin plane spacing on the deformation of copper containing a high density of growth twins

被引：79

作者：

Shan, Z. W. ^{[1
,2
]}

Lu, L. ^{[4
]}

Minor, A. M. ^{[1
,3
]}

Stach, E. A. ^{[5
,6
]}

Mao, S. X. ^{[2
]}

机构：

[1] Lawrence Berkeley Natl Lab, Natl Ctr Electron Microscopy, Berkeley, CA 94720 USA

[2] Univ Pittsburgh, Dept Mech Engn, Pittsburgh, PA 15260 USA

[3] Univ Calif Berkeley, Dept Mat Sci, Berkeley, CA 94720 USA

[4] Chinese Acad Sci, Inst Met Res, Shenyang, Peoples R China

[5] Purdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USA

[6] Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA

来源：

JOM | 2008年 / 60卷 / 09期

关键词：

D O I：

10.1007/s11837-008-0122-z

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In-situ tensile straining in a transmission electron microscope was used to investigate the role of twin plane spacing on the deformation and fracture mechanism of pure copper containing a high densin: of nanoscale growth twins. Real-time and post-mortem observations clearly reveal that twin plane spacing plays a key role in determining the operative deformation mechanism and therefore the subsequent crack propagation path. The deformation mechanism transition, which results front changes in the twin plane spacing, has implications for interpreting the unusual mechanical behavior of the copper with a high density of nanoscale growth twins.

引用

页码：71 / 74

页数：4

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