How to safely apply the LVTSCR for CMOS whole-chip ESD protection without being accidentally triggered on

被引:14
作者
Ker, MD
Chang, HH
机构
[1] Ind Technol Res Inst, Comp & Commun Res Lab, VLSI Design Div, Hsinchu 310, Taiwan
[2] Taiwan Semicond Mfg Co, Design Serv Div, Hsinchu, Taiwan
关键词
electrostatic discharge protection; CMOS; LVTSCR; cascode; stacked SCRs; latch-up;
D O I
10.1016/S0304-3886(99)00037-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the lateral SCR devices used in CMOS on-chip ESD protection circuits are reviewed. Such SCR devices have been found to be accidentally triggered on by noise pulses when IC's are operated in the normal operating condition. A stacked design is therefore proposed to safely apply the LVTSCR devices for whole-chip ESD protection in CMOS IC's without causing unexpected operation errors or latchup danger. Such stacked LVTSCR's with a holding voltage greater than VDD of IC's can provide CMOS IC's with effective component-level ESD protection but without being accidentally triggered on by system-level overshooting or undershooting noise pulses. (C) 1999 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:215 / 248
页数:34
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