Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

被引：81

作者：

Liu, Xiangdong ^{[1
,2
]}

He, Siliang ^{[1
,2
]}

Nishikawa, Hiroshi ^{[1
]}

机构：

[1] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan

[2] Osaka Univ, Grad Sch Engn, Suita, Osaka 5650871, Japan

来源：

SCRIPTA MATERIALIA | 2016年 / 110卷

关键词：

Bonding; Composites; Intermetallic compounds; Sintering; Die attach; LEAD-FREE SOLDERS; CU-SN SYSTEM;

D O I：

10.1016/j.scriptamat.2015.08.011

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn-coated micro-sized Cu particles for high-temperature power device packaging. When used as die attach materials for Cu-Cu bonding, a thermally stable joint comprising a Cu3Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300 degrees C for 30s, and a shear strength equivalent to that of conventional Pb-5Sn solder could be achieved. After isothermal aging at 300 degrees C for 200 h, the shear strength and microstructure of the bonding joints were almost unchanged. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：101 / 104

页数：4

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