Thin Film Wafer Level Encapsulated RF-MEMS Switch for D-Band Applications

被引：0
|
作者：
Wipf, S. Tolunay [1 ]
Goeritz, A. [1 ]
Wietstruck, M. [1 ]
Wipf, C. [1 ]
Tillack, B. [1 ,2 ]
Mai, A. [1 ]
Kaynak, M. [1 ,3 ]
机构：
[1] IHP, Technolpk 25, D-15236 Frankfurt, Oder, Germany
[2] Tech Univ Berlin, HFT4, Einsteinufer 25, D-10587 Berlin, Germany
[3] Sabanci Univ, D-34956 Istanbul, Turkey
来源：
2016 11TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC) | 2016年
关键词：
BiCMOS; mm-wave; wide band; RF-MEMS; SPST; encapsulation; monolithic integration; packaging;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a wafer level packaged (WLP) RF-MEMS switch fabricated in a 0.13 mu m SiGe BiCMOS process technology for D-Band (110-170 GHz) applications. For the wafer level packaging, thin film encapsulation approach is developed and used during the Back-End-of-Line (BEOL) fabrication process. The fabricated wafer level encapsulated (WLE) RFMEMS switch provides a high capacitance Con/Coff ratio of 11.1. The fabricated WLE RF-MEMS switch shows beyond state of the art RF performances of better than 0.67 dB insertion loss and more than 16 dB isolation in all D-band. The measured maximum isolation of the WLE switch is 51.6 dB at 142.8 GHz with an insertion loss of 0.65 dB.
引用
收藏
页码：452 / 455
页数：4
相关论文
共 50 条
  • [1] Thin Film Wafer Level Encapsulated RF-MEMS Switch for D-Band Applications
    Wipf, S. Tolunav
    Goeritz, A.
    Wietstruck, M.
    Wipf, C.
    Tillack, B.
    Mai, A.
    Kaynak, M.
    2016 46TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2016, : 1381 - 1384
  • [2] Electromagnetic and small-signal modeling of an encapsulated RF-MEMS switch for D-band applications
    Wipf, Selin Tolunay
    Goeritz, Alexander
    Wietstruck, Matthias
    Wipf, Christian
    Tillack, Bernd
    Mai, Andreas
    Kaynak, Mehmet
    INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES, 2017, 9 (06) : 1271 - 1278
  • [3] BEOL modifications of a 130 nm SiGe BiCMOS technology for monolithic integration of thin-film wafer-level encapsulated D-Band RF-MEMS switches
    Goeritz, Alexander
    Wipf, Selin Tolunay
    Wietstruck, Matthias
    Kaynak, Mehmet
    Fraschke, Mirko
    Kruger, Andreas
    Lisker, Marco
    2021 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS, 2021,
  • [4] D-Band RF-MEMS SPDT Switch in a 0.13 μm SiGe BiCMOS Technology
    Wipf, Selin Tolunay
    Goeritz, Alexander
    Wietstruck, Matthias
    Wipf, Christian
    Tillack, Bernd
    Kaynak, Mehmet
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2016, 26 (12) : 1002 - 1004
  • [5] Tungsten grid enhanced thin-film wafer-level encapsulation for monolithically integrated D-Band RF-MEMS switches in a 130 nm BiCMOS technology
    Goeritz, Alexander
    Wipf, Selin Tolunay
    Drost, Martin
    Wietstruck, Matthias
    Fraschke, Mirko
    Krueger, Andreas
    Lisker, Marco
    2022 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, DTIP, 2022,
  • [6] Wafer-level thin film micropackaging for RF MEMS applications
    Persano, A.
    Siciliano, P.
    Quaranta, F.
    Lucibello, A.
    Marcelli, R.
    Capoccia, G.
    Proietti, E.
    Bagolini, A.
    Iannacci, J.
    2016 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2016,
  • [7] Wafer-level micropackaging in thin film technology for RF MEMS applications
    A. Persano
    P. Siciliano
    F. Quaranta
    A. Taurino
    A. Lucibello
    Romolo Marcelli
    G. Capoccia
    E. Proietti
    A. Bagolini
    J. Iannacci
    Microsystem Technologies, 2018, 24 : 575 - 585
  • [8] Wafer-level micropackaging in thin film technology for RF MEMS applications
    Persano, A.
    Siciliano, P.
    Quaranta, F.
    Taurino, A.
    Lucibello, A.
    Marcelli, Romolo
    Capoccia, G.
    Proietti, E.
    Bagolini, A.
    Iannacci, J.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 575 - 585
  • [9] Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS Technology
    Goeritz, Alexander
    Wipf, Selin Tolunay
    Drost, Martin
    Lisker, Marco
    Wipf, Christian
    Wietstruck, Matthias
    Kaynak, Mehmet
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (06): : 921 - 932
  • [10] Wafer level thin film encapsulation for BAW RF MEMS
    Pornin, J. L.
    Gillot, C.
    Parat, G.
    Jacquet, F.
    Lagoutte, E.
    Sillon, N.
    Poupon, G.
    Dumont, F.
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 605 - +
12345