Associating damage nucleation and distribution with grain boundary characteristics in Ta

被引：18

作者：

Chen, J. ^{[1
]}

Fensin, S. J. ^{[1
]}

机构：

[1] Los Alamos Natl Lab, Mat Sci & Technol Div, Los Alamos, NM 87545 USA

来源：

SCRIPTA MATERIALIA | 2020年 / 187卷

关键词：

Damage; Grain boundary; Tantalum; Molecular dynamics; DISLOCATION NUCLEATION; TENSILE-STRENGTH; DEFORMATION; INTERFACES; COPPER;

D O I：

10.1016/j.scriptamat.2020.06.035

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The effect of grain boundary (GB) characteristics (as represented by misorientation angle) on its dynamic response is investigated by sampling a large set of 185 GBs in Ta bi-crystals. These GBs encompass both ordered and disordered structures - typically referred to as metastable structures, in order to reflect the diversity in the local atomic structure observed in realistic GBs. The results reveal four distinct regimes in damage distribution and failure modes as a function of misorientation angle. The above trends also correlate with the variation in the corresponding void nucleation stress. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：329 / 334

页数：6

共 36 条

[1] The observation of structural multiplicity in Σ5(310) grain boundaries in FCC metals [J].

Burbery, Nj. ;

Das, R. ;

Ferguson, W. G. .

MATERIALS LETTERS, 2015, 158 :413-415

[2] Understanding and predicting damage and failure at grain boundaries in BCC Ta [J].

Chen, J. ;

Hahn, E. N. ;

Dongare, A. M. ;

Fensin, S. J. .

JOURNAL OF APPLIED PHYSICS, 2019, 126 (16)

[3]

Chen J, 2017, J MAT SCI

[4] Shock wave propagation and spall failure of nanocrystalline Cu/Ta alloys: Effect of Ta in solid-solution [J].

Chen, Jie ;

Tschopp, Mark A. ;

Dongare, Avinash M. .

JOURNAL OF APPLIED PHYSICS, 2017, 122 (22)

[5] Intragranular void formation in shock-spalled tantalum: Mechanisms and governing factors [J].

Cheng, M. ;

Li, C. ;

Tang, M. X. ;

Lu, L. ;

Li, Z. ;

Luo, S. N. .

ACTA MATERIALIA, 2018, 148 :38-48

[6] Atomic scale studies of spall behavior in nanocrystalline Cu [J].

Dongare, Avinash M. ;

Rajendran, Arunachalam M. ;

LaMattina, Bruce ;

Zikry, Mohammed A. ;

Brenner, Donald W. .

JOURNAL OF APPLIED PHYSICS, 2010, 108 (11)

[7] Atomic scale simulations of ductile failure micromechanisms in nanocrystalline Cu at high strain rates [J].

Dongare, Avinash M. ;

Rajendran, Arunachalam M. ;

LaMattina, Bruce ;

Zikry, Mohammed A. ;

Brenner, Donald W. .

PHYSICAL REVIEW B, 2009, 80 (10)

[8] Effects of grain size and boundary structure on the dynamic tensile response of copper [J].

Escobedo, J. P. ;

Dennis-Koller, D. ;

Cerreta, E. K. ;

Patterson, B. M. ;

Bronkhorst, C. A. ;

Hansen, B. L. ;

Tonks, D. ;

Lebensohn, R. A. .

JOURNAL OF APPLIED PHYSICS, 2011, 110 (03)

[9] Why are some Interfaces in Materials Stronger than others? [J].

Fensin, S. J. ;

Cerreta, E. K. ;

Gray, G. T., III ;

Valone, S. M. .

SCIENTIFIC REPORTS, 2014, 4

[10] Nanoscale Plasticity at Grain Boundaries in Face-centered Cubic Copper Under Shock Loading [J].

Fensin, S. J. ;

Brandl, C. ;

Cerreta, E. K. ;

Gray, G. T. ;

Germann, T. C. ;

Valone, S. M. .

JOM, 2013, 65 (03) :410-418

← 1 2 3 4 →