Study of Bonding Technology Using Silver Nanoparticles

被引：92

作者：

Morita, Toshiaki ^{[1
]}

Ide, Eiichi ^{[1
]}

Yasuda, Yusuke ^{[1
]}

Hirose, Akio ^{[2
]}

Kobayashi, Kojiro ^{[2
]}

机构：

[1] Hitachi Ltd, Mat Res Lab, Hitachi, Ibaraki 3191292, Japan

[2] Osaka Univ, Div Mat & Mfg Sci, Suita, Osaka 5650871, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS | 2008年 / 47卷 / 08期

关键词：

silver; nanoparticle; bonding; thermal diffusion; heat resistance;

D O I：

10.1143/JJAP.47.6615

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We investigated a new bonding technique utilizing nano-scaled particles for use in high-ternperature environments. The results of our investigations revealed that the method could be used to form bonds by simultaneously applying heat and pressure. Moreover, compared to a conventional Pb-5Sn-solder bond, a nanoparticle-based bond suffered no degradation in bonding strength over an elevated-temperature holding period of 1000h at 250 degrees C, and its discharge characteristics were improved (i.e., increased) threefold. It is possible to extend this bonding technique to mounting components in devices that operate in high-ternperature environments, e.g., it can be used to Mount components such as silicon carbide (SiC) devices. which are expected to be applied in environments with temperatures exceeding 250 degrees C.

引用

页码：6615 / 6622

页数：8

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