Effects of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp composites

Silicon carbide reinforced copper matrix composites containing 50-80 vol.-%SiCp were fabricated by hot pressing copper coated SIG, powder. The results show that the densification, thermal expansion coefficients, flexural strength, and thermal conductivity of Cu/SiCp composites reinforced by electroless copper plating and their corrosion resistance in 5%NaCl solution are better than those without electroless plating. Physical properties and flexural strength of the composites decrease with an increase in SIG, content, whereas the corrosion resistance increases with an increase in SiCp volume fraction. By observing the Fracture surface after a flexural test, it can be seen there are two types of fracture model: the cracking of Cu/SiCp interface and the pulling out of SiCp particles. The experiment also proved that the bonding strength of the Cu/SiCp interface and the pressure of the hot pressing operation are the two main factors which influence the fracture of these composites.