Thermal Stress Balancing Oriented Model Predictive Control of Modular Multilevel Switching Power Amplifier

被引：28

作者：

Han, Rong ^{[1
]}

Xu, Qianming ^{[1
]}

Ding, Hongqi ^{[2
]}

Guo, Peng ^{[1
]}

Hu, Jiayu ^{[1
]}

Chen, Yandong ^{[1
]}

Luo, An ^{[1
]}

机构：

[1] Hunan Univ, Coll Elect & Informat Engn, Changsha 410082, Hunan, Peoples R China

[2] CRRC ZIC Res Inst Elect Technol & Mat Engn, Zhuzhou 412000, Peoples R China

来源：

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS | 2020年 / 67卷 / 11期

基金：

中国国家自然科学基金;

关键词：

Thermal stresses; Switches; Stress; Power amplifiers; Junctions; Voltage control; Active thermal control; model predictive control (MPC); modular multilevel converter (MMC); switching power amplifier; thermal stress balancing; RELIABILITY; DESIGN;

D O I：

10.1109/TIE.2019.2956384

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Power amplifiers have a wide range of applications in civilian and military areas. In this article, a modular multilevel switching power amplifier (MMSPA) with high power and high output performance is investigated. Due to mismatched parameters or proper control signals among the modules, there may be significant temperature differences among the modules of MMSPA under long-term operations. Uneven temperatures among modules directly lead to premature aging and failure, which in turn affects the overall system reliability. Aiming at the thermal stress imbalance among modules of MMSPA, a model predictive control based on the thermal stress balance is proposed. First, the mathematical model is constructed for the MMSPA. Then, the junction temperature estimation method based on the power loss calculation is presented. On this basis, the finite set control switch state optimization and the switch distribution algorithm for thermal balance are presented. Finally, the proposed active thermal control is verified by the simulation and the experimental results.

引用

页码：9028 / 9038

页数：11

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