Analytical model of Energy Level Alignment at Metal-Organic Interface facilitating Hole Injection

被引:0
|
作者
Shi, Xuewen [1 ,2 ]
Xu, Guangwei [1 ,2 ]
Duan, Xinlv [1 ,2 ]
Lu, Nianduan [1 ,2 ]
Chen, Jiezhi [3 ]
Li, Ling [1 ,2 ]
Liu, Ming [1 ,2 ]
机构
[1] Chinese Acad Sci, Inst Microelect, Key Lab Microelect Device & Integrated Technol, Beijing 100029, Peoples R China
[2] Jiangsu Natl Synerget Innovat Ctr Adv Mat SICAM, Nanjing, Jiangsu, Peoples R China
[3] Shandong Univ, Sch informat Sci & Engn, Jinan, Shandong, Peoples R China
来源
2017 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD 2017) | 2017年
基金
美国国家科学基金会;
关键词
Metal-organic interface; Energy level alignment; Exponential density of states; Electrostatic model;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An analytical description of energy level alignment at metal-organic interface based on a detailed electrostatic model and exponential density of states is presented here. The calculated alignment between the Fermi energy of electrode and the organic transport energy shows good quantitative agreement with the proposed numerical electrostatic model and experimental data, indicating that the analytical model can well describe the material disorder and carrier density. More important, the simulations highlight that the electrode with high effective work functions and the organic material with large dielectric constant can facilitate the hole injection from metal to organic. Finally, the Gaussian distribution density of states has compare to the exponential model, confirmed the accuracy of the analytical description for energy level alignment.
引用
收藏
页码:225 / 228
页数:4
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