High Density 3D Integration

被引：0
|
作者：
Yu, Roy [1 ]
机构：
[1] IBM Corp, TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA
来源：
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2 | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper discusses the current and future needs in continued CMOS scaling, reviews the status of the transfer and joining (TJ) technology for MCM-D and wafer level 3DI integration, and explores the opportunities of the TJ technology in the realm of the "More than Moore" era.
引用
收藏
页码：13 / 22
页数：10
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