Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils

被引：123

作者：

Hyun, Woo Jin ^{[1
]}

Lim, Sooman ^{[1
]}

Ahn, Bok Yeop ^{[2
]}

Lewis, Jennifer A. ^{[2
]}

Frisbie, C. Daniel ^{[1
]}

Francis, Lorraine F. ^{[1
]}

机构：

[1] Univ Minnesota, Dept Chem Engn & Mat Sci, Minneapolis, MN 55455 USA

[2] Harvard Univ, Wyss Inst Biol Inspired Engn, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

来源：

ACS APPLIED MATERIALS & INTERFACES | 2015年 / 7卷 / 23期

关键词：

screen printing; silver ink; silicon stencils; plastic substrates; printed electronics; SOLAR-CELLS; HIGH-RESOLUTION; ELECTRONICS; TRANSISTORS; COMPONENTS; GRAPHENE; PASTES; FILMS; PAPER;

D O I：

10.1021/acsami.5b02487

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 mu m wide. This approach enables printing of high-resolution silver lines with widths as small as 22 mu m. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 x 10(-6) Omega cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).

引用

页码：12619 / 12624

页数：6

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