Interfacial reaction and growth behavior of IMCs layer between Sn-58Bi solders and a Cu substrate

被引:42
作者
Hu, Xiaowu [1 ]
Li, Yulong [1 ]
Min, Zhixian [2 ]
机构
[1] Nanchang Univ, Sch Mech Elect Engn, Nanchang 330031, Peoples R China
[2] China Elect Technol Grp Corp, Res Inst 38, Hefei 230088, Peoples R China
基金
中国博士后科学基金;
关键词
INTERMETALLIC COMPOUNDS; MECHANICAL-PROPERTIES; GRAIN-BOUNDARIES; MICROSTRUCTURE; BISMUTH; JOINTS; COPPER; ELECTRODEPOSITS; INTERCONNECTS; EMBRITTLEMENT;
D O I
10.1007/s10854-012-1052-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports on the interfacial reaction and growth behavior of intermetallic compounds (IMCs) layer (eta-Cu6Sn5 + epsilon-Cu3Sn) between molten Sn-58Bi solder and Cu substrate for various liquid-solid soldering temperatures and times. In addition, the Bi segregation at the Cu3Sn/Cu interface was also discussed, too. It was found that the Cu6Sn5 IMC could be observed as long as the molten solder contacted with the Cu substrate, while the Cu3Sn IMC was formed at the interface between Cu6Sn5 and Cu substrate as the higher soldering temperature and/or longer soldering time were applied. Both thickness of total IMCs layer and Cu6Sn5 grains size increased with increased soldering temperature or time. The growth of the Cu-Sn IMCs layer during soldering exhibited a linear function of the soldering temperature and 0.27 power of soldering time. With soldering temperature increasing (above 280 A degrees C in this present study), Bi was accumulated at the Cu3Sn/Cu interface and resulted in some isolated Bi particles were formed.
引用
收藏
页码:2027 / 2034
页数:8
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  • [21] In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints
    Zhang, Q. K.
    Zhang, Z. F.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (06): : 2686 - 2693
  • [22] Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate
    Zou, H. F.
    Zhang, Q. K.
    Zhang, Z. F.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2012, 532 : 167 - 177