Effect of rotational speed ratio between platen and work piece on lapping processes

Process parameters that are addressed in literature to affect lapping process includes, abrasive grain size, types of abrasive, concentration of abrasives, viscosity of the compound, lapping pressure, lapping speed, lapping time, and lap material/disc material. However, a trajectory analysis of a single fixed abrasive particle shows various paths for different rotational speed ratio between lapping plate and work piece. Therefore, the objective of this paper is to investigate the effect of rotational speed ratio on conventional loose abrasive lapping process. In the study, kinematic trajectories of single fixed abrasive particle were presented for different rotational speed ratios between lapping plate and work piece. Then, experimental study was conducted on sliced silicon wafer samples under different rotational speed ratios and the MRR and surface roughness of each sample was measured. The result reveals that rotational speed ratio between the lapping plate and work piece has an effect on favoring slurry transport between plate and work piece which affects the performance of material removal rate. The future focus of study would be to study optimal rotational speed ratio as one process parameter.