Cu planarization in electrochemical mechanical planarization

被引：35
作者：
Liu, FQ [1 ]
Du, TB [1 ]
Duboust, A [1 ]
Tsai, S [1 ]
Hsu, WY [1 ]
机构：
[1] Appl Mat Inc, Thin Films Grp, Santa Clara, CA 95054 USA
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2006年 / 153卷 / 06期
关键词：
D O I：
10.1149/1.2186180
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The electrochemical mechanical planarization (Ecmp) process is a revolutionary planarization technology uniquely combining removal rate controlled by charge with superior planarization efficiency in the near no-shear regime. A planarization mechanism for Ecmp is proposed to explain the high planarization efficiency. Meanwhile, the effects of applied voltage on removal rate and planarization efficiency are discussed. The electrical feature allows Ecmp to be a planarization process with removal rate independent of downforce, enabling a wide removal rate window and high planarization efficiency. (C) 2006 The Electrochemical Society.
引用
收藏
页码：C377 / C381
页数：5
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