New Low Emissivity Coating on Cenospheres by Electroless Plating

被引：1
|
作者：
Chen Yan [1 ]
Cui YiBin [1 ]
Ma WenXin [1 ]
Wu Chun [1 ]
LiYin Chen [1 ]
YaPing LiJing [1 ]
机构：
[1] Beijing Hitech Inst, Beijing, Peoples R China
来源：
OPTICAL, ELECTRONIC MATERIALS AND APPLICATIONS II | 2012年 / 529卷
关键词：
Electroless; Cenosphere; Infrared emissivity;
D O I：
10.4028/www.scientific.net/AMR.529.92
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low infrared emissivity materials based on cenosphere particles are prepared by chemical electroless Ni-coating process. This metal/inorganic composites were identified by FESEM and XRD, It can be concluded that nickel coatings are formed on the surface of cenospheres by electroless plating and infrared emissivity properties were discussed.
引用
收藏
页码：92 / 95
页数：4
相关论文
共 50 条
  • [21] Coating of carbon nanotube with nickel by electroless plating method
    Li, QQ
    Fan, SH
    Han, WQ
    Sun, CH
    Liang, WJ
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1997, 36 (4B): : L501 - L503
  • [22] Coating of carbon nanotube with nickel by electroless plating method
    Tsinghua Univ, Beijing, China
    Jpn J Appl Phys Part 2 Letter, 4 B (L501-L503):
  • [23] A New Electroless Cu plating Technology
    Chen Bingyi Yao Shibing Zhou Shaomin(Dept.of Chem.
    Xiamen University)
    材料保护, 1991, (05) : 7 - 10
  • [24] New challenges for electroless plating technologies
    Hajdu, Juan
    Transactions of the Institute of Metal Finishing, 1997, 75 (pt 1):
  • [25] Low Temperature and Low Phosphorus Electroless Nickel Plating
    Ma, LiGuo
    Liu, He
    Li, JuJun
    He, YanFeng
    FUNDAMENTAL OF CHEMICAL ENGINEERING, PTS 1-3, 2011, 233-235 : 302 - 305
  • [26] New challenges for electroless plating technologies
    Hajdu, J
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1997, 75 : B7 - B10
  • [27] Electroless plating of copper layer on surfaces of urea-formaldehyde microcapsule particles containing paraffin for low infrared emissivity
    Zhou, Xi
    Mao, Jian
    Qiao, Zhen
    PARTICUOLOGY, 2016, 24 : 159 - 163
  • [28] NEW TECHNIQUE FOR INVESTIGATING ELECTROCHEMICAL BEHAVIOR OF ELECTROLESS PLATING BATHS AND MECHANISM OF ELECTROLESS NICKEL PLATING
    RANDIN, JP
    FELDSTEI.N
    LANCSEK, TS
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (12) : 1969 - &
  • [29] Electroless plating of Ni-P-CNTs composite coating
    Zhao, GG
    Deng, FM
    HIGH-PERFORMANCE CERAMICS III, PTS 1 AND 2, 2005, 280-283 : 1445 - 1448
  • [30] Preparation and Characterization of Copper Powders with Sn Coating by the Electroless Plating
    Uysal, M.
    Cetinkaya, T.
    Gul, H.
    Kartal, M.
    Algul, H.
    Tokur, M.
    Alp, A.
    Akbulut, H.
    ACTA PHYSICA POLONICA A, 2015, 127 (04) : 1106 - 1108
12345