Effect of joining temperature and holding time on microstructure and shear strength of Ti2AlC/Cu joints brazed using Ag-Cu filler alloy

被引:26
作者
Zhang, J. [1 ]
Wang, G. C. [1 ]
Hea, Y. M. [1 ]
Sun, Y. [1 ]
He, X. D. [2 ]
机构
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Ctr Composite Mat & Struct, Harbin 150080, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2013年 / 567卷
关键词
Ti2AlC ceramic; Copper; brazing; Shear strength; TIAL-BASED INTERMETALLICS; INTERFACIAL MICROSTRUCTURE; MECHANICAL-PROPERTIES; STEEL; 35CRMO; INTERLAYER; OXIDATION; CERAMICS; TI3ALC2; PHASES; METAL;
D O I
10.1016/j.msea.2012.12.037
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The present study investigated the effect of brazing temperature and holding time on the microstructure and mechanical properties of Ti2AlC-copper joints brazed with Ag-Cu filler alloy at 800-900 degrees C for 10 min and held for different times at 850 degrees C. The representative structure of the joints was Ti2AlC/interaction area in the Ti2AlC substrate/brazing layer/diffusion area of the copper substrates/Cu. The brazing layer was composed of Cu-rich phases, AlCu2Ti intermetallic compounds and Ag[Cu] solid solutions. With increasing brazing temperature, more filler alloy was infiltrated into the ceramic substrate and reacted with Ti2AlC, accelerating the decomposition of Ti2AlC and the formation of Ti3AlC2, TiC and AlCu2Ti reaction phases. Moreover, more copper substrate was dissolved into the filler alloy; thus, more Cu-rich phase and AlCu2Ti were produced in the brazing layer. Moreover, the width of the brazing layer was reduced, while the widths of both the interaction area and diffusion area increased. As the brazing temperature was increased, the shear joint strength increased and then decreased. By prolonging the holding time, the widths of both the interaction area and the diffusion area were increased, while the width of the brazing layer was held constant at approximately 50 mu m. Neither the structure nor the shear strength of the joints was influenced by the holding time. The optimum brazing parameters for joining Ti2AlC ceramic to copper with Ag-Cu filler alloy were 850 degrees C for 40 min. The joints obtained exhibit a maximum shear strength of 203.3 MPa. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:58 / 64
页数:7
相关论文
共 23 条
  • [11] Electronic structure and chemical bonding in Ti2AlC investigated by soft x-ray emission spectroscopy
    Magnuson, M.
    Wilhelmsson, O.
    Palmquist, J-P.
    Jansson, U.
    Mattesini, M.
    Li, S.
    Ahuja, R.
    Eriksson, O.
    [J]. PHYSICAL REVIEW B, 2006, 74 (19)
  • [12] Sulfidation processing and Cr addition to improve oxidation resistance of TiAl intermetallics in air at 1173 K
    Narita, T
    Izumi, T
    Yatagai, M
    Yoshioka, T
    [J]. INTERMETALLICS, 2000, 8 (04) : 371 - 379
  • [13] Pietzka M.A., 1994, J. Phase Equilib, V15, P392, DOI [10.1007/BF02647559, DOI 10.1007/BF02647559]
  • [14] TEM study of the initial oxide scales of Ti2AlC
    Rao, J. C.
    Pei, Y. T.
    Yang, H. J.
    Song, G. M.
    Li, S. B.
    De Hosson, J. Th. M.
    [J]. ACTA MATERIALIA, 2011, 59 (13) : 5216 - 5223
  • [15] Infrared brazing of TiAl intermetallic using BAg-8 braze alloy
    Shiue, RK
    Wu, SK
    Chen, SY
    [J]. ACTA MATERIALIA, 2003, 51 (07) : 1991 - 2004
  • [16] Interfacial microstructure and joining properties of TiAl/Si3N4 brazed joints
    Song, X. G.
    Cao, J.
    Li, C.
    Feng, J. C.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (22-23): : 7030 - 7035
  • [17] Subramanian P.R., 1993, J. Phase Equilib, V14, P62, DOI DOI 10.1007/BF02652162
  • [18] Villars P., 1995, HDB TERNARY ALLOY PH
  • [19] Microstructure and mechanical strength of transient liquid phase bonded Ti3SiC2 joints using Al interlayer
    Yin, X. H.
    Li, M. S.
    Zhou, Y. C.
    [J]. JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2007, 27 (12) : 3539 - 3544
  • [20] Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer
    Yin, X. H.
    Li, M. S.
    Li, T. P.
    Zhou, Y. C.
    [J]. JOURNAL OF MATERIALS SCIENCE, 2007, 42 (17) : 7081 - 7085