Chemical and Morphological Characteristics of ALP Al2O3 Thin-Film Surfaces after Immersion in pH Buffer Solutions

被引:38
作者
Molina Reyes, Joel [1 ]
Perez Ramos, Berni M. [1 ]
Zuniga Islas, Carlos [1 ]
Calleja Arriaga, Wilfrido [1 ]
Rosales Quintero, Pedro [1 ]
Torres Jacome, Alfonso [1 ]
机构
[1] INAOE, Natl Inst Astrophys Opt & Elect, Puebla 72000, Mexico
关键词
ATOMIC LAYER DEPOSITION; THERMAL-STABILITY; GATE DIELECTRICS; SENSORS; METAL; TECHNOLOGY; ALUMINUM; SILICON; STACKS; OZONE;
D O I
10.1149/2.060310jes
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The chemical and morphological properties of thin aluminum oxide film surfaces (Al2O3 having 10 nm in thickness) in the as-deposited (dry) and after immersion (in pH buffer solutions) conditions were studied. Careful measurement conditions have been followed in order to determine any possible physical and/or chemical change on the surface of these films (after immersion in pH), so that proper correlation to their high and stable sensitivity to pH is possible. After deposition of thin Al2O3 films (by Atomic Layer Deposition, ALD) on chemically oxidized p-type silicon wafers, the resulting Al2O3/SiOX/Si stacked structures were characterized by Fourier-Transform Infrared Spectroscopy (FTIR) and Atomic Force Microscopy (AFM) before and after immersion in pH buffer solutions. Also, the Capacitance-Voltage (C-V) and Current-Voltage (I-V) characteristics were obtained after fabrication of Metal-Insulator-Semiconductor (MIS) devices in order to correlate the good chemical and morphological characteristics of thin Al2O3 to its electrical properties. Based on the characterization results, low surface oxidation/dissolution mechanisms are found in ALD aluminum oxide films when immersed in pH buffer solutions during short immersion times (immersion time <= 10 minutes); therefore, leading to the characteristic slow degradation of the sensitivity to pH for this dielectric material. (C) 2013 The Electrochemical Society. All rights reserved.
引用
收藏
页码:B201 / B206
页数:6
相关论文
共 31 条
[1]  
[Anonymous], 2006, PHYS SEMICONDUCTOR D
[2]   A PROCESS FOR THE COMBINED FABRICATION OF ION SENSORS AND CMOS CIRCUITS [J].
BOUSSE, L ;
SHOTT, J ;
MEINDL, JD .
IEEE ELECTRON DEVICE LETTERS, 1988, 9 (01) :44-46
[3]   OPERATION OF CHEMICALLY SENSITIVE FIELD-EFFECT SENSORS AS A FUNCTION OF THE INSULATOR-ELECTROLYTE INTERFACE [J].
BOUSSE, L ;
DEROOIJ, NF ;
BERGVELD, P .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (10) :1263-1270
[4]   Excellent thermal stability of Al2O3/ZrO2/Al2O3 stack structure for metal-oxide-semiconductor gate dielectrics application [J].
Chang, HS ;
Jeon, S ;
Hwang, H ;
Moon, DW .
APPLIED PHYSICS LETTERS, 2002, 80 (18) :3385-3387
[5]   In-situ techniques in electrochemistry - ellipsometry and FTIR [J].
Christensen, P ;
Hamnett, A .
ELECTROCHIMICA ACTA, 2000, 45 (15-16) :2443-2459
[6]  
Duenas S., 2012, Dielectric Mater, P213
[7]   Atomic layer deposition of Al2O3 films on polyethylene particles [J].
Ferguson, JD ;
Weimer, AW ;
George, SM .
CHEMISTRY OF MATERIALS, 2004, 16 (26) :5602-5609
[8]   Atomic Layer Deposition: An Overview [J].
George, Steven M. .
CHEMICAL REVIEWS, 2010, 110 (01) :111-131
[9]   Al2O3 Atomic Layer Deposition with Trimethylaluminum and Ozone Studied by in Situ Transmission FTIR Spectroscopy and Quadrupole Mass Spectrometry [J].
Goldstein, David N. ;
McCormick, Jarod A. ;
George, Steven M. .
JOURNAL OF PHYSICAL CHEMISTRY C, 2008, 112 (49) :19530-19539
[10]   Electrical characterization of thin Al2O3 films grown by atomic layer deposition on silicon and various metal substrates [J].
Groner, MD ;
Elam, JW ;
Fabreguette, FH ;
George, SM .
THIN SOLID FILMS, 2002, 413 (1-2) :186-197