Challenges and Status on Design and Computation for Emerging Additive Manufacturing Technologies

被引:68
作者
Leung, Yuen-Shan [1 ]
Kwok, Tsz-Ho [2 ]
Li, Xiangjia [1 ]
Yang, Yang [1 ]
Wang, Charlie C. L. [3 ]
Chen, Yong [1 ]
机构
[1] Univ Southern Calif, Epstein Dept Ind & Syst Engn, Los Angeles, CA 90089 USA
[2] Concordia Univ, Dept Mech Ind & Aerosp Engn, Montreal, PQ H3G 1M8, Canada
[3] Chinese Univ Hong Kong, Dept Mech & Automat Engn, Shatin, Hong Kong, Peoples R China
基金
美国国家科学基金会;
关键词
POROUS SCAFFOLD DESIGN; COMPOSITE-MATERIALS; AUTOMATIC DESIGN; STRAIN SENSORS; DISTANCE FIELD; MULTIMATERIAL; OPTIMIZATION; FABRICATION; GEOMETRY; PAPER;
D O I
10.1115/1.4041913
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
The revolution of additive manufacturing (AM) has led to many opportunities in fabricating complex and novel products. The increase of printable materials and the emergence of novel fabrication processes continuously expand the possibility of engineering systems in which product components are no longer limited to be single material, single scale, or single function. In fact, a paradigm shift is taking place in industry from geometry-centered usage to supporting functional demands. Consequently, engineers are expected to resolve a wide range of complex and difficult problems related to functional design. Although a higher degree of design freedom beyond geometry has been enabled by AM, there are only very few computational design approaches in this new AM-enabled domain to design objects with tailored properties and functions. The objectives of this review paper are to provide an overview of recent additive manufacturing developments and current computer-aided design methodologies that can be applied to multimaterial, multi-scale, multiform, and multifunctional AM technologies. The difficulties encountered in the computational design approaches are summarized and the future development needs are emphasized. In the paper, some present applications and future trends related to additive manufacturing technologies are also discussed.
引用
收藏
页数:21
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