Tert-butylamine and allylamine as reductive nitrogen sources in atomic layer deposition of TaN thin films

被引:32
作者
Alén, P
Juppo, M
Ritala, M
Leskelä, M
Sajavaara, T
Keinonen, J
机构
[1] Univ Helsinki, Dept Chem, Inorgan Chem Lab, FIN-00014 Helsinki, Finland
[2] Univ Helsinki, Dept Phys, Accelerator Lab, FIN-00014 Helsinki, Finland
基金
芬兰科学院;
关键词
D O I
10.1557/JMR.2002.0017
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The atomic layer deposition technique was used to deposit TaN thin films from TaCl5 and TaBr5 and tert-butylamine or allylamine as a reductive nitrogen source with and without ammonia. The films were characterized with time-of-flight elastic recoil detection analysis, energy-dispersive x-ray spectroscopy, x-ray diffraction, and the standard four-point probe method. The films deposited from tert-butylamine and ammonia with both tantalum precursors had reasonably low halide contents. When allylamine was used as a nitrogen source, on the contrary, the films contained larger amounts of chlorine and other impurities. The resistivity increased markedly as the deposition temperature was decreased. The lowest resistivities (below 1500 muOmega cm) were obtained when the films were deposited from TaCl5 or TaBr5 with tert-butylamine at 500 degreesC.
引用
收藏
页码:107 / 114
页数:8
相关论文
共 31 条
  • [1] ALEN P, UNPUB J ELECTROCHEM
  • [2] [Anonymous], 1988, Microbeam Analysis
  • [3] Low temperature plasma-assisted chemical vapor deposition of tantalum nitride from tantalum pentabromide for copper metallization
    Chen, XM
    Frisch, HL
    Kaloyeros, AE
    Arkles, B
    Sullivan, J
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1999, 17 (01): : 182 - 185
  • [4] DEPOSITION OF TANTALUM NITRIDE THIN-FILMS FROM ETHYLIMIDOTANTALUM COMPLEX
    CHIU, HT
    CHANG, WP
    [J]. JOURNAL OF MATERIALS SCIENCE LETTERS, 1992, 11 (02) : 96 - 98
  • [5] TICN - A NEW CHEMICAL-VAPOR-DEPOSITED CONTACT BARRIER METALLIZATION FOR SUBMICRON DEVICES
    EIZENBERG, M
    LITTAU, K
    GHANAYEM, S
    MAK, A
    MAEDA, Y
    CHANG, M
    SINHA, AK
    [J]. APPLIED PHYSICS LETTERS, 1994, 65 (19) : 2416 - 2418
  • [6] CHEMICAL-VAPOR-DEPOSITED TICN - A NEW BARRIER METALLIZATION FOR SUBMICRON VIA AND CONTACT APPLICATIONS
    EIZENBERG, M
    LITTAU, K
    GHANAYEM, S
    LIAO, M
    MOSELY, R
    SINHA, AK
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1995, 13 (03): : 590 - 595
  • [7] Photoassisted growth and nitrogen doping of ZnSe
    Hahn, B
    Deufel, M
    Meier, M
    Kastner, MJ
    Blumberg, R
    Gebhardt, W
    [J]. JOURNAL OF CRYSTAL GROWTH, 1997, 170 (1-4) : 472 - 475
  • [8] GROWTH OF TAC THIN-FILMS BY REACTIVE DIRECT-CURRENT MAGNETRON SPUTTERING - COMPOSITION AND STRUCTURE
    HAKANSSON, G
    PETROV, I
    SUNDGREN, JE
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1990, 8 (05): : 3769 - 3778
  • [9] NITRIDES OF TITANIUM, NIOBIUM, TANTALUM AND MOLYBDENUM GROWN AS THIN-FILMS BY THE ATOMIC LAYER EPITAXY METHOD
    HILTUNEN, L
    LESKELA, M
    MAKELA, M
    NIINISTO, L
    NYKANEN, E
    SOININEN, P
    [J]. THIN SOLID FILMS, 1988, 166 (1-2) : 149 - 154
  • [10] *JOINT COMM POWD D, 321283 JOINT COMM PO