Constitutive Behavior and Processing Map of T2 Pure Copper Deformed from 293 to 1073 K

被引:12
|
作者
Liu, Ying [1 ]
Xiong, Wei [1 ]
Yang, Qing [1 ]
Zeng, Ji-Wei [1 ]
Zhu, Wen [2 ]
Sunkulp, Goel [3 ]
机构
[1] Nanjing Univ Sci & Technol, Sch Mat Sci & Engn, Nanjing 210094, Jiangsu, Peoples R China
[2] Suzhou Nonferrous Met Res Inst, Suzhou 215026, Peoples R China
[3] Nanjing Univ Sci & Technol, Herbert Gleiter Inst Nanosci, Nanjing 210094, Jiangsu, Peoples R China
关键词
constitutive equation; deformation behavior; dynamic material model; microstructure; processing map; T2 pure copper; HOT DEFORMATION-BEHAVIOR; TEMPERATURE FLOW-STRESS; ALUMINUM-ALLOY; STRAIN-RATE; MODEL; EQUATION; STEEL; MICROSTRUCTURE; COMPRESSION; EVOLUTION;
D O I
10.1007/s11665-018-3210-4
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The deformation behavior of T2 pure copper compressed from 293 to 1073 K with strain rates from 0.01 to 10 s(-1) was investigated. The constitutive equations were established by the Arrhenius constitutive model, which can be expressed as a piecewise function of temperature with two sections, in the ranges 293-723 K and 723-1073 K. The processing maps were established according to the dynamic material model for strains of 0.2, 0.4, 0.6, and 0.8, and the optimal processing parameters of T2 copper were determined accordingly. In order to obtain a better understanding of the deformation behavior, the microstructures of the compressed samples were studied by electron back-scattered diffraction. The grains tend to be more refined with decreases in temperature and increases in strain rate.
引用
收藏
页码:1812 / 1824
页数:13
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