Thermoelectric properties of Ag-doped CuS nanocomposites synthesized by a facile polyol method

被引:71
作者
Tarachand [1 ]
Hussain, S. [2 ]
Lalla, N. P. [1 ]
Kuo, Y. -K. [3 ]
Lakhani, A. [1 ]
Sathe, V. G. [1 ]
Deshpande, U. [1 ]
Okram, G. S. [1 ]
机构
[1] UGC DAE Consortium Sci Res, Univ Campus,Khandwa Rd, Indore 452001, Madhya Pradesh, India
[2] UGC DAE Consortium Sci Res, Kalpakkam Node 603104, Kokilamedu, India
[3] Natl Dong Hwa Univ, Dept Phys, Hualien 97401, Taiwan
关键词
COPPER SULFIDE NANOPARTICLES; STRUCTURAL-PROPERTIES; THIN-FILMS; PERFORMANCE; COMPOSITES; SPECTROSCOPY; ENHANCEMENT; TEMPERATURE; CONDUCTION; EFFICIENCY;
D O I
10.1039/c7cp07986a
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We report the first thermoelectric properties of Cu1-xAgxS, x = 0-0.75 nanocomposites, synthesized by using a facile polyol method. Systematic characterizations using powder XRD, Rietveld refinement of XRD, EDAX, XPS and Raman spectroscopy confirmed their single phase, hexagonal crystal structure with the space group P63/mmc, nominal elemental composition, valence states of the constituent elements and stoichiometric nature. The TEM images showing the CuS formation of nearly perfect hexagonal disk-like particles of average thickness 26.7 nm and breadth ranging in a few hundreds of nanometers with nanorods stacked from these hexagonal nanodisks (NDs) elongated along the c axis corroborate the FESEM images. Attributed to structural phase transition, an anomaly at 55 K is clearly observed in both the thermopower and Hall resistivity data. By increasing x, a systematic reduction in thermal conductivity was observed near 300 K. Consequently, a 50% enhancement in figure of merit was observed for Cu0.9Ag0.1S as compared to pure CuS at 300 K. These results therefore are expected to provide a new direction in improving ZT near 300 K.
引用
收藏
页码:5926 / 5935
页数:10
相关论文
共 55 条
[1]   Phosphonic acid monolayers for binding of bioactive molecules to titanium surfaces [J].
Adden, Nina ;
Gamble, Lara J. ;
Castner, David G. ;
Hoffmann, Andrea ;
Gross, Gerhard ;
Menzel, Henning .
LANGMUIR, 2006, 22 (19) :8197-8204
[2]  
Ashcroft N. W., 1976, NUMERICAL DATA SOLID
[3]   Electron energy filtering by a nonplanar potential to enhance the thermoelectric power factor in bulk materials [J].
Bahk, Je-Hyeong ;
Bian, Zhixi ;
Shakouri, Ali .
PHYSICAL REVIEW B, 2013, 87 (07)
[4]   High thermoelectric performance of (AgCrSe2)0.5(CuCrSe2)0.5 nano-composites having all-scale natural hierarchical architectures [J].
Bhattacharya, Shovit ;
Bohra, Anil ;
Basu, Ranita ;
Bhatt, Ranu ;
Ahmad, Sajid ;
Meshram, K. N. ;
Debnath, A. K. ;
Singh, Ajay ;
Sarkar, Shaibal K. ;
Navneethan, M. ;
Hayakawa, Y. ;
Aswal, D. K. ;
Gupta, S. K. .
JOURNAL OF MATERIALS CHEMISTRY A, 2014, 2 (40) :17122-17129
[5]   The formation of Cu2S from the elements I.: Copper used in form of powders [J].
Blachnik, R ;
Müller, A .
THERMOCHIMICA ACTA, 2000, 361 (1-2) :31-52
[6]   Preparation and transport properties of polycrystalline Bi and Bi-SiO2 nanocomposites [J].
Brochin, F ;
Lenoir, B ;
Devaux, X ;
Martin-Lopez, R ;
Scherrer, H .
JOURNAL OF APPLIED PHYSICS, 2000, 88 (06) :3269-3275
[7]   Electrical transport properties of CuS single crystals [J].
Casaca, A. ;
Lopes, E. B. ;
Goncalves, A. P. ;
Almeida, M. .
JOURNAL OF PHYSICS-CONDENSED MATTER, 2012, 24 (01)
[8]   Synthesis and Characterization of Copper Sulfide Nanoparticles Obtained by the Polyol Method [J].
Castillon-Barraza, F. F. ;
Ferias, M. H. ;
Coronado-Lopez, J. H. ;
Encinas-Romero, M. A. ;
Perez-Tello, M. ;
Herrera-Urbina, R. ;
Posada-Amarillas, Alvaro .
ADVANCED SCIENCE LETTERS, 2011, 4 (02) :596-601
[9]   Template-free and green sonochemical synthesis of hierarchically structured CuS hollow microspheres displaying excellent Fenton-like catalytic activities [J].
Deng, Chonghai ;
Ge, Xinqing ;
Hu, Hanmei ;
Yao, Li ;
Han, Chengliang ;
Zhao, Difang .
CRYSTENGCOMM, 2014, 16 (13) :2738-2745
[10]   CuS nanoflowers prepared by a polyol route and their photocatalytic property [J].
Ding, Tong-Yong ;
Wang, Ming-Sheng ;
Guo, Sheng-Ping ;
Guo, Guo-Cong ;
Huang, Jin-Shun .
MATERIALS LETTERS, 2008, 62 (30) :4529-4531