Dynamic alignment control for fluid-immersion lithographies using interferometric-spatial-phase imaging

被引:21
作者
Moon, EE
Mondol, MK
Everett, PN
Smith, HI
机构
[1] MIT, Elect Res Lab, Nanostruct Lab, Cambridge, MA 02139 USA
[2] Patrick N Everett Consulting, Concord, MA USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2005年 / 23卷 / 06期
关键词
GAP MEASUREMENT;
D O I
10.1116/1.2101725
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate the application of a high-sensitivity alignment method called interferometric-spatial-phase imaging (ISPI) to a nanometer-level overlay in fluid-immersion lithography, using step-and-flash imprint lithography as the test vehicle. As a stringent test we used alignment marks that consist of pure phase gratings in a fused silica template, immersed in a fluid of similar refractive index, resulting in a low-contrast alignment signal. Feedback control of alignment is demonstrated with mean = 0.0 nm and sigma = 0.1 nm using an immersed template. Overlay results, with UV-exposed imprint fluid, were limited to similar to 4 nm, due to a mechanical disturbance. Because ISPI enables continuous monitoring of the alignment signal, we were able to identify the origin of the mechanical disturbance and can eliminate it in future experiments. In addition, we demonstrate the ability to actively reduce misalignment during the progression of crosslinking in the imprint fluid. (c) 2005 American Vacuum Society.
引用
收藏
页码:2607 / 2610
页数:4
相关论文
共 3 条
[1]   Nanometer gap measurement and verification via the chirped-Talbot effect [J].
Moon, EE ;
Chen, L ;
Everett, PN ;
Mondol, MK ;
Smith, HI .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (06) :3378-3381
[2]   Interferometric-spatial-phase imaging for six-axis mask control [J].
Moon, EE ;
Chen, L ;
Everett, PN ;
Mondol, MK ;
Smith, HI .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2003, 21 (06) :3112-3115
[3]   Novel mask-wafer gap measurement scheme with nanometer-level detectivity [J].
Moon, EE ;
Everett, PN ;
Meinhold, MW ;
Mondol, MK ;
Smith, HI .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1999, 17 (06) :2698-2702