Micromachined Probes for Submillimeter-Wave On-Wafer Measurements-Part I: Mechanical Design and Characterization

被引：18

作者：

Reck, Theodore J. ^{[1
]}

Chen, Lihan ^{[2
]}

Zhang, Chunhu ^{[2
]}

Arsenovic, Alex ^{[2
]}

Groppi, Christopher ^{[3
]}

Lichtenberger, Arthur W. ^{[2
]}

Weikle, Robert M., II ^{[2
]}

Barker, N. Scott ^{[2
]}

机构：

[1] Jet Prop Lab, Pasadena, CA 91030 USA

[2] Univ Virginia, Charles L Brown Dept Elect Engn, Charlottesville, VA 22903 USA

[3] Arizona State Univ, Sch Earth & Space Explorat, Tempe, AZ 85287 USA

来源：

IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY | 2011年 / 1卷 / 02期

关键词：

Coplanar waveguide; micromachining; rectangular waveguide; submillimeter-wave integrated circuits; submillimeter-wave measurements; GALLIUM-ARSENIDE; FILM; AU;

D O I：

10.1109/TTHZ.2011.2165013

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The mechanical design and characterization of a micromachined on-wafer probe scalable to submillimeter-wave frequencies is presented. The design consists of a silicon micromachined probe with a ground-signal-ground configuration on a 15 mu m thick silicon substrate. This micromachined chip is housed in a metal waveguide block that provides mechanical support for the probe and enables coupling to a waveguide flange. Load-cell measurements of the probe show a DC contact resistance below 0.07 Omega with an applied force of 1 mN. A companion paper presents the electromagnetic design and calibrated on-wafer measurements at 500 to 750 GHz.

引用

页码：349 / 356

页数：8

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