Between-core vector overlapping for efflicient core testing of system-on-chip LSI circuits

被引:0
作者
Shinogi, Tsuyoshi [1 ]
Yamada, Yuki [1 ]
Hayashi, Terumine [1 ]
Yoshikawa, Tomohiro [1 ]
Tsuruoka, Shinji [1 ]
机构
[1] Mie Univ, Dept Elect & Elect Engn, Tsu, Mie 5148507, Japan
来源
ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS | 2006年 / 89卷 / 12期
关键词
test vector overlapping; parallel core testing; overlapped vectors; system on chip; LSI production testing;
D O I
10.1002/ecjb.20322
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the authors propose a method for efficient parallel core testing for manufacturing testing of system-on-chip LSIs that consist of multiple full-scan cores; this method is called "between-core vector overlapping." To shorten the time needed to test the entire SoC LSI, this uses a single bit sequence for test data (overlapped vector) obtained by overlapping test vectors of multiple cores as much as possible; during testing, this is fed jointly to each core, so that multiple cores can be tested in parallel. A key benefit of this method is that it minimizes the number of external input pins needed for testing multiple cores in parallel. To further reduce test times, the authors also propose methods for shortening the overlapped vectors: invert overlapping and split overlapping. Tests show these methods to be effective. (C) 2006 Wiley Periodicals, Inc.
引用
收藏
页码:53 / 62
页数:10
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