共 41 条
- [3] In situ TEM observation of microcrack nucleation and propagation in pure tin solder [J]. MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2006, 127 (01): : 62 - 69
- [5] Thermally induced variations in structural and mechanical properties of rapid solidified Tin-based alloys [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 506 (1-2): : 135 - 140
- [6] Gao NY, 2017, 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), P352, DOI 10.1109/ICEPT.2017.8046470
- [9] Hu M, 2013, 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), P173, DOI 10.1109/ICEPT.2013.6756449