Molecular Dynamics Simulation of Tension of Al2Cu with Voids

A molecules dynamic simulation model was established to simulate the tension of Al2Cu with voids at normal temperature and constant engineering strain rate. The influence of void size, quantity and its distribution on the mechanical properties of Al2Cu was studied by embedded atomic method. The results show that the void causes the appearance of free surface in the model and stress concentration at the inner edge of void, which greatly reduce the tensile strength and deformation ability of the material. In addition, the plastic and tensile strength of Al2Cu decrease obviously with the increase of void size. The stress-strain curves corresponding to different numbers of voids basically overlap in the elastic deformation stage, and for more voids, the plasticity and tensile strength decrease. According to the change of void distribution, it can be found that the smaller the angle between the connection direction of the voids and the tensile direction, the stronger the plasticity and tensile strength of Al2Cu.