Improved Cleaning Process for Etch Residue Removal in an Advanced Copper/low-k Device without the use of DMAC (dimethylacetamide)

被引：0
作者：
Jung, Chung-Kyung [1 ]
Joo, Sung-Wook [1 ]
Ryu, Sang-Wook [1 ]
Naghshineeh, S. [2 ]
Yang, Lee [2 ]
Han, Jae-Won [1 ]
机构：
[1] Dongbu Hitek Semicond Co, Adv Nanotech Dev Team, 474-1 Sangwoo Ri, Kamgok Myeon 369852, Chungbuk, South Korea
[2] Surface Chem Discoveries Inc, Bethlehem, PA 18015 USA
来源：
ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES X | 2012年 / 187卷
关键词：
Toxic Chemical; Copper; Polymer Residue; Low-k; Cleaning Method; Solvent;
D O I：
10.4028/www.scientific.net/SSP.187.245
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：245 / +
页数：2
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