A Quad-Core 28-32 GHz Transmit/Receive 5G Phased-Array IC with Flip-Chip Packaging in SiGe BiCMOS

被引：0

作者：

Kibaroglu, Kerim ^{[1
]}

Sayginer, Mustafa ^{[1
]}

Rebeiz, Gabriel M. ^{[1
]}

机构：

[1] Univ Calif San Diego, La Jolla, CA 92093 USA

来源：

2017 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2017年

关键词：

5G communication link; transmit/receive; phased array; beamforming; 28; GHz; Ka-band; SiGe; flip-chip;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This work presents a quad-core 28-32 GHz transmit/receive phased-array integrated circuit (IC) with flipchip packaging for 5G communication links. The IC consists of 4 Tx/Rx channels each with 6-bit phase and 14 dB amplitude control. The noise figure in the RX mode is 4.6 dB, the lowest reported to date to our best knowledge, and the output power in transmit mode is 10 dBm at P1dB. The power consumption is 105 mW and 200 mW in the RX and TX modes respectively, per channel. The chip is flipped on a low cost RF board with a 2x2 antenna array for a range of system-level measurements. The array has a measured EIRP of 24.5 dBm, and is used in a 1 meter communication link achieving 64-QAM 2.4 Gbps data rate with an EVM of 2.89%.

引用

页码：1896 / 1898

页数：3

共 5 条

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